Thermal separation between box and module ensures high performance over the whole lifetime (patened)
Low forward voltage drop through - large conductor cross section - excellent contacting (welding) of wires - connectors with lamella spring contact
Typically 0.5 % more power output than other junction boxes
Defined glueing/sealing area for mounting onpanel – distance pins and glue groove for controlled application and defined sealing gapQuick, clean potting by direct injection; suited for automation