| Electrical data | CECC 22000 | Requirements | |||||||||||||||||
| Impedance |
50 |
||||||||||||||||||
| Frequency range |
DC ... |
12.4 |
GHz | ||||||||||||||||
|
Typical return loss (mated pair) |
DC - 2.5 GHz 32 dB |
2.5 - 6 GHz 30 dB |
6 - 12.4 GHz 16 dB |
||||||||||||||||
| Dielectric withstanding voltage1) | 4.4.5 |
1 kV |
rms, |
50 Hz | |||||||||||||||
| Working voltage1) | IEC 169-1 11.6.1 |
≤ 330 V |
rms, |
50 Hz | |||||||||||||||
| Insulation resistance | 4.4.4 |
≥ |
1 GΩ | ||||||||||||||||
|
Contact resistance - centre contact - outer contact |
4.4.2 4.4.3 |
|
5 mΩ 1 mΩ |
||||||||||||||||
1) at sea level
| Mechanical data | CECC 22000 | Requirements | |||||||||||||||||
| Engagement force * | 4.5.4 | max. 30 N / max. 6.7 lbs | |||||||||||||||||
| Disengagement force * | 4.5.4 | 8 - 30 N / 1.8- 6.7 lbs | |||||||||||||||||
| Durability (matings) | 4.7.1 | 500 | |||||||||||||||||
* MMBX
| Material data | |||||||||||||||||||
| Connector parts | Material | Plating | |||||||||||||||||
| MMBX centre contact | copper-beryllium alloy | SUCOPRO/gold | |||||||||||||||||
| MMBX outer contact | brass/copper-beryllium | SUCOPRO | |||||||||||||||||
| MMBX body | brass/copper-beryllium | SUCOPRO | |||||||||||||||||
| MMBX insulators | LCP / PTFE / PFA | ||||||||||||||||||
| Environmental data | CECC 22000 | Equivalent mil test conditions | |||||||||||||||||
| Temperature range | -55°C ... +155°C / - 67° F ... + 311° F | ||||||||||||||||||
| Climatic category | → 55 / 155 / 21 | ||||||||||||||||||
| Thermal shock | 4.6.7 → IEC 68-2-14 Na | MIL-STD-202, Method 107 G, Condition B1 | |||||||||||||||||
| Moisture resistance | 4.6.6 → IEC 68-2-3 Ca | MIL-STD-202, Method 106 F | |||||||||||||||||
| Corrosion | 4.6.10 → IEC 68-2-11 Ka | MIL-STD-202, Method 101, Condition B | |||||||||||||||||
| Vibration | 4.6.3 → IEC 68-2-6 Fc | MIL-STD-202, Method 204 D, Condition A | |||||||||||||||||
Some connectors may have a specification that differs from the above mentioned data.
The products are designed and guaranteed to pass the above mentioned test procedures. Any additional or different requirement arising from specific applications or environmental conditions which is not covered by these test procedures is subject to request.